TDK Memory Bus Interface Type Specification Sheet
(1/1)
001-04 / 20070219 / ew_004.fm
• All specifications are subject to change without notice.
NAND-type Flash Memory Controller IC GBDriver XR
Memory Bus Interface Type
For Small Embedded Systems without an ATA/IDE interface
NAND-type Flash Memory has occupied significant place in embedded systems. In many cases the system size is small and an ATA
interface is not used. The TDK GBDriver XR bridges those host interfaces without an ATA bus to NAND-type Flash Memory. The built-in
engine is the TDK GBDriver RA3 controller. The GBDriver RA3 is the recipient of numerous design wins and strong interest from our
customer base.
GBDriver XR interfaces with a common memory bus such as SRAM bus, enabling CPU to connect with and thus control NAND-type
Flash Memory directly. GBDriver XR makes it possible to build storage systems even if they do not have hard disk interface such as ATA/
IDE. The XR is packaged in an ultra-small, ultra-thin VFBGA. This simplifies insertion into portable devices, mobile terminals, and small
IT home appliances.
FEATURES
• World’s first NAND-type Flash Memory controller interfacing with
common memory bus, such as a one chip LSI solution.
• Realizes 6MB/s burst writes when directly connected with the
system bus.
• Controls NAND-type Flash Memory up to 4GB. Confirmed
compatibility with Flash Memories of several makers.
∗
• High reliability in Write and Read by TDK original systematic
control over NAND-type Flash Memory.
• ATA compatible register interface, suitable for use with the FAT
file system, only low level driver required.
• Available in 8mm
VFBGA100pin package.
• Supports auto recovery function (option)
• Conforms to the RoHS directives.
∗
Please contact us to confirm the Flash Memory compatibility.
MAIN APPLICATIONS
• Flash memory modules
• Silicon storage
• Boot devices for embedded systems
APPLICATIONN EXAMPLES
• For NOR Flash-/HDD- replacement applications.
• For user data storage applications; home information
appliances, STBs, PDAs, mobile phones, etc.
• For booting embedded systems of WindowsXP Embedded-base
or Linux-base.
SHAPES AND DIMENSIONS
VFBGA100pin Single Chip
SPECIFICATIONS
Conformity to RoHS Directive
Timing specifications
Host I/F
120ns[Burst cycle]
180ns[Single cycle]
Flash I/F
90ns
Power specifications
Host I/F
2.7 to 3.6V
Core
2.7 to 3.6V
Flash I/F
2.7 to 3.6V
System clock
33.33MHz
[External clock support]
Temperature ranges
Operating
–40 to +85°C
Storage
–55 to +125°C
Power consumption
(ref.)
Reading
41mA[3.0V]
Writing
40mA[3.0V]
8.0
ø
0.25
0.38
6.75
0.75
8.0
0.18 to 0.28
1.0max.
6.75
Dimensions in mm
C
Solder
ball
Detail of ball
10 9 8 7 6 5 4 3 2 1
1 2 3 4 5 6 7 8 9 10
A
B
C
D
E
F
G
H
J
K
A
B
C
D
E
F
G
H
J
K
A1 corner
marking
A1 corner
marking
0.10
C
100-ø0.25 to 0.35
Land & lead
Solder resist
Substrate
Opening size
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• GBDriver is a registered trademark of TDK Corporation
• CompactFlash
TM
is a trademark of SanDisk Corporation