Ezurio WISMC01BI Manual - page 12
© 2005-2006 Ezurio Ltd
Data Sheet
11
8. Board to Board Connector
This chapter provides specifications for the 40-pin board-to-board connector which serves as physical
interface to the host application. The receptacle assembled on the Module is Hirose type DF12C. Details
are available at: http://www.hirose.co.jp/cataloge_hp/e53700036.pdf
8.1
Stacking Height
Mating headers from Hirose are available in different stacking heights, allowing the spacing between
the BISM2 and carrier pcb to be changed from 3.5mm to 5.0mm.
Notes: The headers listed above are with boss and metal fitting.
Suffix -86 denotes RoHS compliance.
See
http://www.hirose.co.jp/cataloge_hp/e53700036.pdf
for detail information on the PCB socket.
8.2
Hirose Connector general specification
Parameter
Specification (40 pin Board to Board connector)
Number of Contacts
40
Quantity delivered
2000 Connectors per Tape & Reel
Voltage
50V
Current Rating
0.5A max per contact
Resistance
0.05 Ohm per contact
Dielectric Withstanding Voltage
500V RMS min
Operating Temperature
-45°C...+125°C
Contact Material
phosphor bronze (surface: gold plated)
Insulator
Material PA , beige natural
Stacking height
3.0 mm ; 3.5 mm ; 4.0 mm ; 5.0 mm
Insertion force
21.8N
Withdrawal force 1st
10N
Withdrawal force 50th
10N
Maximum connection cycles
50
Item
Part number
Stacking height
HRS number
Receptacle on
Module
DF12C-40DS-0.5V(86)
3.5 mm – 5 mm
CL537-0007-7-86
Headers DF12 series DF12(3.5)-40DP-0.5V(86)
3.5 mm
CL537-0032-4-86
DF12(4.0)-40DP-0.5V(86)
4.0 mm
CL537-0057-5-86
DF12(5.0)-40DP-0.5V(86)
5.0 mm
CL537-0157-0-86