Fractus TVNow User Manual - Assembly
February 2013
Page 8
1999-2013 © FRACTUS, S.A.
5.
ASSEMBLY
PROCESS
Figure 3 shows the back and front view of the
TVNow
TM
Dual Band (UHF+Lband) DVB-H antenna , and
indicates the location of the feeding point and the mounting pads:
Figure 3 –
Views of the TVNow
TM
dual band (UHF+Lband) DVB-H antenna
As a surface mount device (SMD), this antenna is compatible with industry standard soldering processes. The
basic assembly procedure for this antenna is as follows:
1.
Apply a solder paste to the pads of the PCB. Place the antenna on the board.
2.
Perform a reflow process according to the temperature profile detailed in Table 3, Figure 5 on page 9.
3.
After soldering the antenna to the circuit board, perform a cleaning process to remove any residual
flux. Fractus recommends conducting a visual inspection after the cleaning process to verify that all
reflux has been removed.
The drawing below shows the soldering details obtained after a correct assembly process:
Figure 4 -
Soldering Details
NOTE:
Solder paste thickness after the assembly process will depend on the thickness of the soldering stencil
mask. A stencil thickness equal to or larger than
127 microns (5 mils)
is required.
Mounting Pads (
2, 3, 4, 5
)
: solder the antenna mounting pads to the
soldering pads on the PCB. These pads must NOT be grounded.
Feed Pad (
1
)
: align the feed point with the feeding line on the PCB.
Antenna
PCB
Solder Paste
Antenna
PCB
~
0.1* mm
1
2
3
4
5