Navia KL3333 Operation Manual - page 21
Navigation device (receiver)
NAVIA
GNSS - KL 3333
Operation manual 2.0
21
Installation
The receivers NAVIA GNSS - KL 3333 developed as products intended for installation on
board the target device (OEM product).
The receiver is designed for installation as components of both the automated assembly lines,
and for manual mounting and soldering both leaded and lead-free solder paste and/or solders.
In the manual installation must be carried out using a grounded soldering iron with tip heated
to a temperature no higher than 240 °C. The duration of contact of the receiver terminal should not
exceed 3 seconds. The interval between adjacent terminals must be at least 2 seconds between
repeated rations to the same conclusion - at least 30 seconds.
There is the temperature profile in the case of using lead-free solder pastes during automated
installation in Fig. 16. The cooling rate should not exceed 3 ° C per second. Schedule thermoprofile
in the case of leaded pastes will be similar in appearance, but to select the temperature and time of
each stage should be guided by the documentation of manufacturers for the respective pastes.
With bilateral mounting the receiver board must be installed on the other side, which is
mounted and soldered in the final pass through the reflow oven, as otherwise the metal screens
mounted on the receiver board can break away from the soldering and fall inside the oven.
Fig.
16. The temperature profile for soldering the receivers using leaded-free pastes.
When dismantling (desoldering) the receivers from the final product PCB are not allowed to
heat them to a temperature exceeding 250 °C. Withal, residence time at temperatures above 230
°C should not exceed 40 seconds. In case of overheating, operation dismantled receivers can be
broken.
Products dismantled with clear signs of overheating and/or mechanical damage cannot
be repaired or replaced under warranty.
Also, do not be repaired or replaced under warranty dismantled units whose condition
does not allow for analysis of their performance (peel of tracks or pads, offset of screen or
components, excess solder on the pads and/or terminals do not allow to insert the product in
the test equipment).