Ramsey Electronics LPA1 Instruction Manual - page 6
LPA1
• 6
Double sided component soldering instructions:
You’ll notice that the circuit board contains plating on both sides of the board,
with a large ground “plane” area on the component side of the circuit board.
In order to electrically connect this topside ground plane to the bottom side
ground connections, it will be necessary to solder some connections on both
the top and bottom sides of the circuit board.
These topside connections will be clearly pointed out when necessary in the
assembly instructions. When so instructed, be sure the solder “flows” around
the topside connection, as shown. When installing a disc capacitor, be sure
to scrape away any insulating material which may be coated on the lead near
the components’ body. Also, be aware that for every part that you solder on
the top side of the board, there should also be a connection on the bottom
side for that same lead.
Another important consideration when building high frequency RF circuits is
to keep the component lead lengths as short as mechanically possible to
keep the components close to the PC board. This will avoid adding stray ca-
pacitance or inductance into the circuit.
5
Component
(Disc Cap shown)
Topside solder
connection
"Normal" bottomside
connection