TDK-Lambda PH-A280 Series Instruction Manual - Tdk-Lambda
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TDK-Lambda
PH-A280 Series
INSTRUCTION MANUAL
(4) Recommended Material of PCB
Recommended materials of the printed circuit board is double sided glass epoxy with through holes.
(thickness t:1.6mm , copper 35μm)
(5) Input / Output Pattern Width
Large current flows through input and output pattern. If pattern width is too narrow, heat on pattern will increase
because of voltage drop of pattern. Relationship between allowable current and pattern width varies depending
on materials of printed circuit board, thickness of conductor. It is definitely necessary to confirm on
manufacturers of printed circuit board for designing pattern.
(6) Method of Connecting Terminals
Connect +Vin, -Vin, +V, -V with consideration of contact resistance .
7-2. Heatsink Installation Method
(1) Method of Fixing Heatsink
To fix the heatsink onto power module, use M3 screws and mount it to the M3 threaded holes (2 places) at
the base-plate side. Recommended torque is 0.54 N∙m.
Use silicone grease or thermal conductive sheet in between heatsink and base-plate to minimize the contact
thermal resistance and to enhance the heat conductivity.
Also use the no-warped heatsink and make sure good contact between base-plate and heatsink.
(2) Mounting Hole of Heatsink
Recommended mounting hole is as follows.
φ
3.5 Non-threaded hole
7-3. Regarding Vibration
The vibration specification of the power supply is determined assuming that only the power supply is mounted
on printed circuit board. To prevent excessive force to the power supply and the printed circuit board, fix the
heatsink to the chassis as well as to the power supply when a large size of heatsink is used.
7-4. Recommended Soldering Condition
Recommended soldering conditions are as follows.
(1) Soldering dip
Dip condition : 260ºC within 10 seconds
Pre-heat condition : 110ºC for 30 - 40 seconds
(2) Soldering iron
350ºC within 3 seconds
Note) Soldering time changes according to heat capacity of soldering iron, pattern on printed circuit board,
etc. Please confirm actual performance.
7-5. Recommended Cleaning Condition
Recommended cleaning condition after soldering is as follows.
(1) Cleaning solvent
IPA (isopropyl alcohol )
(2) Cleaning Procedure
Use brush and dry the solvent completely.