Cadence CADENCE MASKCOMPOSE RETICLE AND WAFER SYNTHESIS SUITE Datasheet - page 3
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CADENCE MASKCOMPOSE RETICLE AND WAFER SYNTHESIS SUITE
Thedefinition/implementationpartitioning
of the MaskCompose suite lends itself to
a cross-discipline usage model. Floorplan
definitions may be created and controlled
byphotomasking/lithographyorCAD
specialists while actual design-specific
implementations can be handled in the
design group by the layout specialist.
The definition module is used to specify
technology parameters, i.e. layer polarities
andmin/maxscribesizes.Includeditems
may be defined as required vs. optional
and assigned placement priority values.
Scribe sizes may be specified in terms of
a minimum size, maximum size, and an
increment value by which the scribe size
is increased until all required features are
placed or maximum size is reached.
Definitions may be constrained to allow
for various types of equipment mix and
match(forexample,1x/5xmixesor
stepper vendor combinations).
Multi-circuit and multi-layer
mask generation
The automated cluster builder may be
used to quickly and easily define die
clusters. Any number of circuits of various
sizes may be quickly composed into a
cluster using this capability. A cluster may
be full-field or may be small enough to
array multiple times within the lens area
of the reticle. Multi-layer reticles (MLRs)
may be defined in the definition module
and controlled in the implementation
phase. The layers can be stripped out in
the output of MaskCompose or can be
stripped out in the jobdeck.
Interactive placement mode
If desired, the reticle design
implementation phase may be conducted
in a semi-automatic fashion in which
specified items become candidates for a
drag-and-drop placement methodology.
This novel functionality enables easy
runtime customization of floorplans by
the user, and is useful in the foundry
environment where requirements are fixed
in a flow definition, and where optional
items are made available to customers for
their additions via drag-and-drop mode.
Interactive wafer module
The user also has the ability to manually
manipulate and control the wafer layout or
stepping patterns. The interactive wafer
module provides the following user controls:
• Addordropexposures(shots)
• Add,delete,move,copy,andplace
drop-in(s)
• Modifyorintroducerowand
column shifting
• Markadditionalnon-yieldingdie
AUTOMATIC PAPERwORK
gENERATION
• Templatebased
• Customformats
• Postscriptdiagrams
• Accesstogeneratedand
external information
• Externalprogramaccess
The MaskCompose paperwork generation
module uses information generated by
other MaskCompose modules and other
provided information to rapidly create
easily readable documents with
customizedformats.Variouskindsof
documents, including mask order forms,
stepper tooling forms, and internal
archive documentation, can be generated.
Because information is extracted directly
from the MaskCompose database,
content consistency is assured. As
an option, documents can include
automatically generated postscript and
pdf diagrams of generated frame data.
Information that is not captured or
generated by MaskCompose can be
extracted from files or prompted for at
runtime by embedding appropriate
commands in the various templates used.
Based on the directions in a template,
text entry fields, option menus, or other
appropriate interface components will
appear in the user’s screen at runtime to
prompt for and to collect the relevant
information needed to generate the
desired documents.
AUTOMATIC jOBDECK
gENERATION
• Rapidgenerationofmask
vendor-specific jobdecks
• Enablesmix-and-matchstepper
environments
The MaskCompose jobdeck generation
product works cooperatively within the
MaskCompose environment using
existing, relevant information made
available by other modules. Frame
Figure 3: Cadence MaskCompose interactive wafer module