Application note gr/gs64 sim interface reference: wi_dev_gx64_apn_013 revision: 001 date: february 14, 2007.
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Table of contents 1 introduction............................................................................................ 4 1.1 notation ............................................................................................................... 4 1.2 abbreviations ...............................
1 introduction this application note introduces guidelines associated with the selection of components, design, and interfacing methods for a solution using the gr/gs64 line of wireless cpus. While it is not intended to be an exhaustive coverage of the topic of gsm sim design, these guidelines provi...
1.2 abbreviations abbreviation description emc electro magnetic compatibility sim subscriber identity module 1.3 sim types the table below gives a list of vendors for sim-cards, their logotype and foot prints. Vendor logotype connection pattern axalto gemplus g&d m-systems text says “m.Mar” gr/gs64 ...
Vendor logotype connection pattern oberthur orga 1.4 pin connectivity • c1: vcc • c2: rst • c3: clk • c5: gnd • c6: vpp (only used by service provider) • c7: io gr/gs64 application note this document is the sole and exclusive property of wavecom. Not to be distributed or divulged without prior writt...
2 interfacing the sim this section describes how to interface the sim and lists things to look out for when it comes to component layout and routing. This is very important for type approval, since the required testing is very stringent. 2.1 insertion and removal the sim should preferably be inserte...
2.2 schematic considerations to make the design optimal and provide a flexible design for the type approval process it is beneficial to add optional components. Figure 1: recommended component provisions depending on the implementation transorbs might be needed to pass emc-tests. It is important to ...
2.2.1 simvcc the simvcc-signal has a built-in 470nf capacitor inside the wireless cpu. This capacitance might not be enough, and it might not add the capacitance where it is really needed. Provision for a capacitor (c vcc ) ranging between 1uf to 10uf or more should be made available as close to the...
2.2.3 simdat the simdat-line has a built-in 10k pull-up resistor implemented inside the wireless cpu. This pull-up resistance might not be enough to pass the io type approval test cases (27.17.2.5) depending on the application implementation. The application should provide the capability of adding a...
3 type approval 3.1 electrical test cases the electrical test cases are specified in §27.17 of the etsi 3gpp ts 51010-1 specification. The attached link points to the 51010-1 specification archive within etsi. ( http://www.3gpp.Org/ftp/specs/archive/51_series/51.010-1/ ) 3.1.1 vcc the sim supply vol...
3.2 test connections the sim type approval test equipment can be connected to the application in two different ways: 1. Paddle 2. Flying leads the test facility will most likely perform all tests using the paddle. This is the most realistic and easiest way to test the device. This test method does h...
Sim interface page: 13/13 gr/gs64 application note this document is the sole and exclusive property of wavecom. Not to be distributed or divulged without prior written agreement. Ce document est la propriété exclusive de wavecom. Il ne peut être communiqué ou divulgué à des tiers sans son autorisati...
