Connect Tech Xtreme/10G User Manual - Thermal Details
Xtreme/10G Managed Ethernet Switch/Router
Users Guide
www.connecttech.com
Document: CTIM-00472
Revision: 0.04
Page 21 of 24
Connect Tech Inc. 800-426-8979 | 519-836-1291
Date: 2017-07-27
Thermal Details
XDG201 Thermal Parameters
Thermal Parameter
Value
Minimum Ambient Operating Temperature
-40 °C
Maximum Operating Junction Temperature
of all chipsets
125 °C
Total Solution TDP
24
Die junction to package case top (SoC/PHY)
3.27 °C/W
Die junction to PCB (SoC/PHY)
6.03 °C/W
Die junction to Ambient (SoC/PHY)
12.14 °C/W
Die junction to moving air @ 1 m/s (SoC/PHY)
9.42 °C/W
XHG201 – Conduction Cooled Heatplate
The XHG201 is a flat heatplate that can be used to interface the XDG201 to another thermal extraction layer
(chassis wall, finned heat sink etc). It is not intended to be used in a standalone application.