Madell Technology Corporation TYR108C Manual - Madell Technology, Corp.
Madell Technology, Corporate Office, 1141 E Philadelphia Street, Ontario, CA 91761
t. 877-670-9023 f. 909-418-6956
Website:
www.madelltech.com
; Technical Service Email: info@madelltech.com
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Madell Technology, Corp.
4.5 Description of Temperature Curve
The control of temperature curve is critical to ensure soldering quality. The temperature curve is
soldering past melting curve, which consists of five processes: temperature rising process
→
temperature keeping process
→
rapid temperature rising process
→
soldering process
→
cooling
process. Here is an example of temperature curve for leaded soldering: the temperature rising
process is from room temperature to 145°C, and the heating unit is heating; 145°C - 160°C is
temperature keeping phase, at which the soldering flux in the soldering paste volatilizes fully, and at
which the heating tube conducts adjustment according to the situation whether there is a difference
between the set temperature and the actual temperature or not and flickering occurs; when the
temperature reaches more than 183°C, the soldering paste melts; the temperature rises continuously
and soldering is conducted; after the soldering is completed, the air cooling process is carried out.
Thus, a complete soldering process is over.
The bases to set the temperature curve of the reflow soldering machine:
A. Set the temperature curve of the reflow soldering machine according to the temperature curve
of soldering paste. The temperature curve of soldering paste varies with the metal contents,
so the temperature curve of the reflow soldering machine for specific product shall be set
according to the temperature curve of soldering paste provided by the soldering paste
supplier.
B. Set different temperature curve based on the material, thickness, layers and size of PCB. If
PCBs are aluminum based boards, the temperature shall be set a little higher (adjusted up by
30±10°C according to the size and quantity of PCBs); for thin PCBs (especially less than
1.2mm), the temperature shall be set a little lower.
C. Set the temperature curve based on the density, size and color of components mounted on
PCB and based on the situation if there are special components on PCB, such as BGA, CSP
etc.
D. The reflow soldering machine is a flash heating system, so there is difference between