Madell Technology Corporation TYR108C Manual - Madell Technology, Corp.
Madell Technology, Corporate Office, 1141 E Philadelphia Street, Ontario, CA 91761
t. 877-670-9023 f. 909-418-6956
Website:
www.madelltech.com
; Technical Service Email: info@madelltech.com
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Madell Technology, Corp.
1. General
With the constant development of electronic technology, Surface Mount Technology (SMT) has
been being used more and more widely and nitrogen soldering has become a trend, for this reason,
Madell Technology hammers at the development and supply of mini SMT production equipment to
drive the popularization of this technology and to contribute to the development of electronic industry
in China. The mini fully automatic reflow soldering machine TYR108C is an economic and practical
model, which is finely designed and developed based on the Madell Technology’s technicians’
technology experience accumulated in many years and the practical needs of domestic customers,
and which has the features such as high precision and multiple function, economic and practical,
energy saving and consumption reducing, stable performance, long service life and visualized
operation etc., so, it is ideal equipment used for the small-lot and multi-variety production in small- and
medium-scale electronic factories and for the scientific research and production in some electronic
enterprises and scientific research institutes, and also supplementary equipment in medium- and
large-scale SMT production lines. In order to gain better service from this model of machine, please
read this brochure carefully prior to putting the machine into operation.
2. Main Technical Characteristics
1. Number of temperature control segments: 1-128; up to 8*16 segments of program can be
set and stored in the reflow soldering machine according to practical needs.
2. Number of temperature zones: Single zone with multiple temperature segment control.
3. Temperature control system: Automatic temperature control using microcomputer;
non-contact SSR output.
4. Accuracy of temperature: ±1°C.
5. Temperature rise time: 90s to enter into temperature keeping zone.
6. Temperature range: Room temperature to 300°C.
7. Heat source: Infrared + hot air convection.
8. Effective area of work bench: 350mm*250mm (larger than A4 paper), on which maximum
size 350mm*250mm of PCB can be put.
9. Soldering time: 6min±1min.
10. Temperature curve: 1-8 pieces of temperature curve can be set in the reflow soldering
machine according to needs. User can select the temperature curve according to the
accuracy for product soldering. There are four default pieces of curve, e.g. leaded,
lead-free, cure etc. in the machine for selection. Cure 1: about 90s for temperature
keeping at 150°C; cure 2: about 5 min for temperature keeping at 150°C.
11. Cooling system: Cross-flow type balanced rapid cooling.
12. Rated voltage: Single phase AC 220V, 50Hz.
13. Rated power: 4.2KW; average power: 1.5kW.
15. Separate air exhausting duct for cooling: The ON/OFF of air duct is automatically
controlled through the electric controlled door to effectively ensure the airtightness of hot room.
16. Weight: 45kg.
17. Outside dimensions: 620(L)*460(W)*385(H)mm.
18. External RS232 interface, input of K-type thermocouple, drive for solid state relay,
cooling signal and ringing signal.